Position
The substrate is exposed to a controlled process zone without immersing its opposite surface.
Contact MATECH
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WAVEETCH™ / SINGLE-SIDED WET PROCESSING
Etch one side.
Protect the other.
Precision wet etching and wafer thinning without coating, masking, or otherwise protecting the non-process side.
NON-PROCESS SIDE REMAINS UNDISTURBED
CONTROLLED PROCESS SIDE
<0.1%
ACHIEVABLE TTV
01
True single-sided processing
02
No backside protection
03
Fewer handling steps
04
Lab-to-fab scalability
01 — PROCESS ADVANTAGE
A simpler route to
controlled results.
WaveEtch confines the wet chemistry to the process surface while keeping the opposite side unaffected by either liquid or vapor incursion. The result is a precise, clean, ultra-uniform, alternative to conventional immersion, spray or spin wet processing.
By eliminating backside protection and the steps used to apply and remove it, WaveEtch can reduce handling, process time, cost, and opportunities for damage or contamination. The latter is particularly true for thin substrates or very fragile materials such as InP or GaAs.
02 — HOW IT WORKS
Confine the chemistry.
Control the outcome.
Process
Etchant or thinning chemistry is delivered precisely to the selected side under repeatable conditions.
Rinse & dry
Integrated processing completes the cycle while minimizing transfers and unnecessary handling.
03 — SYSTEM FAMILY
One process architecture.
Three scales of operation.
Choose the configuration that fits development, flexible production, or high-throughput fab integration. Process capabilities and options can be tailored to the application.
0 1 / WAVEETCH
456-G2
High-throughput productionThe flagship WaveEtch platform pairs the family’s highest throughput with a full-size, cassette-to-cassette wafer loader and unloader (EFEM).
Automated fab configuration
→
0 2 / WAVEETCH
212me / 212me2
Flexible productionA compact, dry-in/dry-out platform with the full WaveEtch process capability, configurable with one or two mini-EFEMs and substrate-handling options.
Balanced footprint and throughput
→
0 3 / WAVEETCH
112-G
Manual-load systemThe most streamlined member of the family: manual load and unload with full-featured dry-in/dry-out processing and the same single-sided etching quality.
Development and lower-volume work
→
04 — APPLICATIONS
Built for demanding materials and exacting processes.
WaveEtch processes can be optimized for the material, removal target, substrate geometry, and required uniformity.
Request a process evaluation →
0
1
III-V compound semiconductors
0
2
GaAs wafer processing
0
3
Laser diode fabrication
0
4
Advanced optical components
0
5
MEMS and microfabrication
0
6
Custom substrate development
START WITH THE PROCESS
Tell us what you need to etch,
thin, or protect.
MATECH can help define the right process and system configuration for your material, throughput, automation, and facility requirements.
Talk with an engineer ↗