WaveEtch™
True single-sided wet etching and wafer thinning—without backside protection.
- Unparalleled uniformity
- Broad substrate compatibility
- Laboratory to fully automated fab systems
PRECISION PROCESS TECHNOLOGY
Single-sided wet processing, precision chemical delivery, and custom-engineered systems for semiconductor, optoelectronic, optical, aerospace, and defense applications.
Selected customers & research partners
01 — CORE SYSTEMS
MATECH develops process and systems for applications where precision, reliability, and results are non-negotiable.
True single-sided wet etching and wafer thinning—without backside protection.
Precision chemical pumping, metering, and mixing with no moving parts in the chemical path.
CONTROLLED / LOCALIZED / REPEATABLE
02 — DIFFERENT BY DESIGN
Our patented technologies eliminate conventional compromises: protect the unprocessed surface, reduce handling, deliver precise chemical volumes, and simplify complex workflows.
03 — FEDERAL & AEROSPACE
Since 1992, MATECH has contributed to advanced programs for NASA, the Department of Defense, Department of Energy, and many leading American research institutions.
Explore Federal Systems →MATECH developed processes and fabrication equipment used to create hundreds of delicate X-ray optical elements.
04 — MATECH
Founded in 1992 by physicist Dr. Ricardo I. Fuentes, MATECH combines semiconductor processing, advanced materials, chemistry, optics, and aerospace engineering to solve problems that do not fit conventional solutions.