MATECH — Materials and Technologies Contact MATECH ↗

MATECH / IN THE PRESS

Ideas in
circulation.

Selected articles, technical papers, and outside coverage documenting MATECH technologies and technical perspective.

TRADE PRESS / TECHNICAL PAPERS Process technology explained in depth.

From innovation and product development to single-sided wet processing and ultrathin wafer handling.

01 — FEATURED PAPER

Single-sided wafer thinning.
Practical handling.

CHIP SCALE REVIEW JAN / FEB 2011

Single Sided Wafer Thinning and Handling

A technical article on chemical thinning of wafers to 50 µm or less and carrier-free handling of ultrathin substrates, with emphasis on uniformity, warpage, fragility, stress relief, and practical production handling.

Open featured paper ↗

02 — TECHNICAL ARCHIVE

Process technology,
in the literature.

Selected papers from MATECH’s technical archive covering WaveEtch™, LinearScan™, wafer thinning, texturing, packaging, and ultrathin-wafer handling.

01
SOLID STATE TECHNOLOGY JULY 2007

Extending Process Flexibility for Single-wafer Wet Etch

A technical examination of single-wafer wet processing that separates chemical reaction from transport limitations and expands process flexibility across substrate types and geometries.

Open paper ↗
02
IWLPC / WAFER-LEVEL PACKAGING OCTOBER 2010

Single Sided Wafer Thinning for 3D Integration

Field results for high-uniformity, single-sided wet thinning of wafers to 50 µm or below, with emphasis on 3D wafer-level integration, process uniformity, and elimination of backside protection.

Open paper ↗
03
3D INTEGRATION / TECHNICAL PAPER ARCHIVE

Wafer Thinning for 3D Integration

A broader look at wafer thinning as an enabling technology for increased package density and 3D integration as conventional feature-size scaling approaches practical limits.

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04
IWLPC OCTOBER 2012

Single Sided Wet Etching for Texturing, Thinning, and Packaging Applications

A conference paper describing LinearScan™ wet processing for controlled texturing, thinning, stress relief, and packaging applications, including very thin and fragile substrates.

Open paper ↗
05
MATECH / AERIS™ TECHNICAL PAPER

Chemical Delivery and Metering System with No Moving Parts for High Purity and Other Industrial Applications

A technical paper on the Aeris™ positive-displacement, piston-less chemical delivery architecture, designed for precision metering, high-purity service, reliability, and reduced maintenance.

Open paper ↗
06
SEMICONDUCTOR PACKAGING NEWS FEBRUARY 9, 2016

VIEWPOINT: Ricardo Fuentes, CEO/President, MATECH

A perspective on why continued innovation is difficult, why markets reward a credible future of innovation, and why technical organizations must keep looking beyond the daily grind for the next useful idea.

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07
CIRCUITNET / CHIP SCALE REVIEW JAN / FEB 2011

Single Sided Wafer Thinning and Handling

Chip Scale Review article on chemical wafer thinning and carrier-free handling of ultrathin substrates.

Open external copy ↗

03 — CURRENT WORK

The archive is history.
The work continues.

For current company, product, customer, and program updates, visit MATECH News. For a deeper discussion of a process or application, contact us directly.