02 — TECHNICAL ARCHIVE
Process technology,
in the literature.
Selected papers from MATECH’s technical archive covering WaveEtch™, LinearScan™, wafer thinning, texturing, packaging, and ultrathin-wafer handling.
Extending Process Flexibility for Single-wafer Wet Etch
A technical examination of single-wafer wet processing that separates chemical reaction from transport limitations and expands process flexibility across substrate types and geometries.
Open paper
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Single Sided Wafer Thinning for 3D Integration
Field results for high-uniformity, single-sided wet thinning of wafers to 50 µm or below, with emphasis on 3D wafer-level integration, process uniformity, and elimination of backside protection.
Open paper
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Wafer Thinning for 3D Integration
A broader look at wafer thinning as an enabling technology for increased package density and 3D integration as conventional feature-size scaling approaches practical limits.
Open paper
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Single Sided Wet Etching for Texturing, Thinning, and Packaging Applications
A conference paper describing LinearScan™ wet processing for controlled texturing, thinning, stress relief, and packaging applications, including very thin and fragile substrates.
Open paper
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Chemical Delivery and Metering System with No Moving Parts for High Purity and Other Industrial Applications
A technical paper on the Aeris™ positive-displacement, piston-less chemical delivery architecture, designed for precision metering, high-purity service, reliability, and reduced maintenance.
Open paper
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VIEWPOINT: Ricardo Fuentes, CEO/President, MATECH
A perspective on why continued innovation is difficult, why markets reward a credible future of innovation, and why technical organizations must keep looking beyond the daily grind for the next useful idea.
Read external article
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Single Sided Wafer Thinning and Handling
Chip Scale Review article on chemical wafer thinning and carrier-free handling of ultrathin substrates.
Open external copy
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