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Selected articles, technical papers, and outside coverage documenting MATECH technologies and technical perspective.
From innovation and product development to single-sided wet processing and ultrathin wafer handling.
01 — FEATURED VIEWPOINT
A perspective on why continued innovation is difficult, why markets reward a credible future of innovation, and why technical organizations must keep looking beyond the daily grind for the next useful idea.
Read the external article ↗02 — TECHNICAL ARCHIVE
Selected papers from MATECH’s technical archive covering WaveEtch™, LinearScan™, wafer thinning, texturing, packaging, and ultrathin-wafer handling.
A technical examination of a single-wafer wet-processing architecture designed to separate chemical reaction from transport limitations and expand process flexibility across substrate types and geometries.
Open paper ↗Field results for high-uniformity, single-sided wet thinning of wafers to 50 µm or below, with emphasis on 3D wafer-level integration, process uniformity, and elimination of backside protection.
Open paper ↗A broader look at wafer thinning as an enabling technology for increased package density and 3D integration as conventional feature-size scaling approaches practical limits.
Open paper ↗A conference paper describing LinearScan™ wet processing for controlled texturing, thinning, stress relief, and packaging applications, including very thin and fragile substrates.
Open paper ↗A discussion of chemical thinning and non-contact handling approaches for ultrathin wafers, addressing warpage, fragility, stress relief, and practical production handling.
Open paper ↗03 — CURRENT WORK
For current company, product, customer, and program updates, visit MATECH News. For a deeper discussion of a process or application, contact us directly.